Reduction of Chipping out in Die Separation Process of Psi Technologies Inc. Using DMAIC Methodology

Abstract

DMAIC methodology is known to be the roadmap of problem solving as well as reducing defects and process
improvement. The main objective of the study is to reduce the defects in the production of the company using DMAIC
methodology. The study was conducted in Psi Technologies Inc. located at lot C3-6 Carmelray, Industrial Park II,
Barangay Punta, Calamba City, Laguna Philippines. In this work, the data were obtained from the company and
different defects within the production were analyzed. The die chipping out was found to be the highest number of
defects caused in the production line. In addition, process mapping has been carried out to see which process is the
highest contributor to chipping out and, as a result, the process of die separation contributes to the highest number
of chipping out. The authors analyzed the die separation process and found that the machine rollers used to separate
the die were not working well and were the root cause of the defect. Thus, the findings have shown that it is
necessary to regularly change the rollers of the die separation machine in order to reduce the defective chipping.