Dielectric Characterization of Epoxy resin Filled with Micro and Nano fillers of SiO2 and Al2O3 for Encapsulations of Electronic Devices

  • J. Ganesan, S. Jeyadevi, D. Prince Winston, S. Devakirubakaran, B.Gurukarthik Babu

Abstract

In recent years Epoxy resin plays important role in Information Technology and Electronics sector because of its wide range of applications. It is used in the manufacturing of major electronic components such as transistors, printed circuit boards, Solar panels, and many other devices. In this paper, the normal epoxy resin has been integrated with the Micro and Nanofillers to enhance its dielectric strength and dielectric loss. The performance enhancement of the composited epoxy resin has been measured and compared with the normal epoxy resin. The proposed epoxy resin has been tested in both AC and DC circuits with various composition levels. In AC circuits, the 3:1 composition of Micro silica and alumina has the less power loss sampled at 100 Hz and 100ᵒ C and it has the more power loss sampled at 5 MHz and 100ᵒ C with the composition of 1:3. In DC circuits, the 3:1 composition of Micro silica and alumina has the less power loss sampled at 50 Hz and 150ᵒ C and it has the more power loss sampled at 5 MHz and 150ᵒ C with the composition of 1:3.. The semiconducting devices are operating with the high temperature stress, where the resin coating has employed for reducing the heat dissipation. The experimental validation of the composite epoxy resin at various composition levels, various sample rates has given and compared with the normal epoxy resin. The efficiency of the epoxy resin is measured by coated it on the semiconducting devices.

Keywords- Dielectrics, Dielectric strength, Epoxy Resin, Fillers, Dielectric Strength, Dielectric Loss, Semiconductor

Published
2021-02-12
Section
Articles